Main Specifications |
Device Type | MicroBlade |
Built-in Devices | MBD-B3ST1-CPU-001 |
Processor |
Compatible Processors | Support Intel Xeon processor E-2300 series |
Compatible Socket | Single Socket H5 (LGA 1200), CPU TDP support up to 95W |
Cache/Core | Up to 8 cores, 16 threads |
System Memory |
Memory Capacity | 4 DDR4 DIMM sockets, Supports up to 128GB DDR4 ECC VLP UDIMM |
Memory Type | 3200MHz ECC DDR4 UDIMM |
DIMM Sizes | 32GB |
Memory Voltage | 1.2V |
Error Detection | Corrects single-bit errors, Detects double-bit errors (using ECC memory) |
On-Board Devices |
Chipset | Intel C256 chipset |
Network Controllers | Dual 10GbE LAN ports |
IPMI | Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM) |
TPM | 1 TPM Header |
System BIOS |
BIOS Type | 128Mb Flash EEPROM |
BIOS Features | Plug and Play (PnP), APM 1.2, SMBIOS 2.7.1 |
Front Panel |
LEDs | Power LED, Fault LED, Network Activity LED, UID / KVM LED |
Expansion / Connectivity |
Expansion Bays Total (Free) | 1x SATA DOM |
| 2x Up to 2x 2.5" U.2 SATA/NVMe drives |
M.2 | M.2 Key: M-Key |
| M.2 Form Factor: 2280/22110 |
| M.2 Interface: 1 SATA3/NVMe (PCIe 3.0 from PCH) and 1 NVMe (PCIe 4.0) |
Environmental |
Operating Environment | Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) |
| Operating Relative Humidity: 8% to 90% (non-condensing) |
| Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Operating Temperature: 10°C to 38°C (50°F to 100.4°F) |
Electromagnetic Compatibility (EMC) |
United States / Canada | FCC- Emissions (US) Verification |
Europe | EN55022 - Emissions, EN55024 - Immunity, EN61000-3-2 - Harmonics, EN61000-3-3 - Voltage Flicker, CE - EMC Directive 89/336/EEC |
Parts List - (Items Included) |
Motherboard / MicroBlade Sled | MBD-B3ST1-CPU-001 / MCP-680-31408-0N |
Micro Blade Module Chassis | 1x MCP-620-31409-0N, 1x MCP-620-31412-0N, 1x MCP-620-31416-0N, 1x MCP-640-31409-0N |
Add-On Card | 1x AOM-BPNIO-MSH2-P |
System Cooling |
Air Shroud | 1x MCP-310-31407-0N |