| Management |
| Software | SuperDoctor® 5 |
| IPMI 2.0 |
| Power Configurations | Power-on mode for AC power recovery |
| ACPI Power Management |
| PC Health Monitoring |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Status monitor for speed control |
| Pulse Width Modulated (PWM) fan connectors |
| Fans with tachometer monitoring |
| Temperature | Monitoring for CPU and chassis environment |
| CPU thermal trip support, PEPI |
| Front Panel |
| Buttons | UID button |
| Power On/Off |
| LEDs | Power status |
| LAN1 activity |
| System information |
| Motherboard |
| Motherboard | Super X12SPED-F |
| Processor (per Node) |
| CPU | 3rd Gen Intel® Xeon® Scalable processors |
| Single Socket P+ (LGA-4189) |
| Support CPU TDP 85-270W |
| Please contact Supermicro Technical Support for supporting conditions of high power (TDP >205W) processors. |
| Cores | Up to 32C/64T; Up to 48MB Cache |
| System Memory (per Node) |
| Memory | Memory Capacity: 8 DIMM slots |
| Memory Type: 3200MHz ECC DDR4 RDIMM/LRDIMM |
| Memory Voltage | 1.2 V |
| Error Detection | ECC |
| On-Board Devices (per Node) |
| Chipset | Intel® C621A |
| Network Connectivity | 1x 1GbE BaseT port(s) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 |
| IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output (per Node) |
| LAN | 1 RJ45 GbE LAN port (Shared NIC |
| Video | 1 VGA port(s) |
| Serial Port | 1 COM Port(s) (1 COM) |
| Others | 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable) |
| Chassis |
| Form Factor | 2U Rackmount |
| Model | CSE-SE201-R2K06P |
| Note | 16.9” (430mm) chassis depth |
| Front access IO design, and tool less serviceability |
| Three front hot-swappable nodes with single CPU socket and 8 DIMM design |
| Dimensions and Weight |
| Height | 3.5" (88mm) |
| Width | 17.7" (449mm) |
| Depth | 16.9" (430mm) |
| Package | 9.5" (H) x 29.5" (W) x 23.2" (D) |
| Weight | Net Weight: 55.1 lbs (25 kg) |
| Gross Weight: 70.6 lbs (32 kg) |
| Available Color | Silver |
| Drive Bays / Storage (per Node) |
| Drive Bays | N/A |
| M.2 | 2 M.2 NVMe |
| M-Key, 2280/22110 |
| System Cooling |
| Air Shroud | 3 Air Shroud(s) Air Shroud(s) |
| Power Supply |
| Total Output Power | 2000W : (-44) - (-60) Vdc |
| Dimension (W x H x L) | 73.5 x 40 x 265 mm |
| +12V | Max: 166.6A |
| 12V SB | Max: 4A |
| Certification |
| Operating Environment |
| Environmental Spec. | Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) |
| Operating Relative Humidity: 8% to 90% (non-condensing) |
| Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F) |
| Note | Operating Temperature (CPU TDP up to 270W) : Continuous0°C to 35°C (32°F to 95°F) |
| Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 35°C (32°F ~ 95°F), Short term -5°C ~ 55°C (23°F ~ 131°F) |
| Product SKUs |
| Product SKUs | SYS-210SE-31D |
| Expansion Slots (per Node) |
| PCI-Express (PCIe) | 1 PCIe 5.0 x16 LP slot(s) |
| 2 PCIe 4.0 x16 FHHL slot(s) |
