To maintain quality and integrity, this product is sold only as a completely-assembled system (with 2 CPUs, Min. of 4 DIMMs, 1 AIOM/AOC NIC and 1 Storage Device)
Memory Type: 4800MHz ECC DDR5 RDIMM Up to 512GB of memory
Note
For optimal performance AMD recommends full memory population
On-Board Devices
Chipset
System on Chip
Network Connectivity
Via AIOM
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
1 Dedicated IPMI LAN port
USB
2 USB 3.0 port(s) (2 rear)
Video
1 VGA port(s)
System BIOS
BIOS Type
AMI 256MB SPI Flash
BIOS Features
USB Keyboard support
Plug and Play (PnP)
ACPI 6.4
SMBIOS 3.5 or later
UEFI 2.8
Management
Software
Watch Dog
SuperDoctor® 5
SUM
SSM
SPM
IPMIView for Linux/ Windows
IPMICFG
Power Configurations
ACPI Power Management
Power-on mode control for AC power loss recovery
PC Health Monitoring
Voltage
System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
FAN
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Fans with tachometer monitoring
Front Panel
Buttons
UID button
Power On/Off
LEDs
HDD activity
Power status
LAN1 activity
System information
Power Supply
Certification
Titanium Level
Dimension (W x H x L)
73.5 x 40 x 265 mm
AC Input
1000W: 100-127Vac / 12A-9A / 50-60Hz
1600W: 200-240Vac / 9A-7.5A / 50-60Hz
+12V
Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB
Max: 3.5A / Min: 0A
Output Type
25 Pairs Gold Finger Connector
Product SKUs
Product SKUs
AS -2025HS-TNR
Motherboard
Motherboard
Super H13DSH
Processor
CPU
4th Generation AMD EPYC™ 9004 Series Processor
Support CPU TDP up to 360W *
Dual Socket SP5
Cores
Up to 192C/384T
Note
*Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
Chassis
Form Factor
2U
Model
CSE-HS829-R1K63P-A
Dimensions and Weight
Height
3.5" (88.9mm)
Width
17.2" (437mm)
Depth
31.6" (803mm)
Package
10.4" (H) x 23.8" (W) x 43.6" (D)
Weight
Gross Weight: 69 lbs (31.3 kg)
Net Weight: 39 lbs (17.7 kg)
Available Color
Black front & sliver body
Expansion Slots
PCI-Express (PCIe)
4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
Drive Bays / Storage
Hot-swap
12x 3.5" hot-swap NVMe/SATA/SAS drive bays
M.2
M-Key, 2280/22110
2x NVMe (PCIe 3.0 x4, Boot drive only)
System Cooling
Fans
4x 8cm heavy duty fans with optimal fan speed control
Air Shroud
2 Air Shroud(s)
Operating Environment
Environmental Spec.
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
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