| Main Specifications |
| Device Type | 100Gb Network Adapter |
| Form Factor | Advanced I/O Module (AIOM) |
| Dimensions (WxDxH) | Card PCB dimensions: 76mm x 115mm (W x D) |
| Connectivity |
| Connectors | Dual QSFP28 Ports: 2x100G |
| Networking |
| Storage Accelerations | NVMe over Fabric offloads for target, Storage protocols: iSER, NFSoRDMA, SMB Direct, NVMe-oF, and more T-10 Dif/Signature Handover |
| Management and Control | NC-SI, MCTP over SMBus and MCTP over PCI-E - Baseboard Management Controller interface, PLDM for Monitor and Control DSP0248, PLDM for Firmware Update DSP026, I2C interface for device control and configuration |
| Remote Boot | Remote boot over Ethernet, Remote boot over iSCSI, UEFI support for x86 and Arm servers, PXE boot |
| Specifications |
| RDMA over Converged Ethernet: | RoCE v1/v2, Zero-Touch RoCE: no ECN, no PFC, RoCE over overlay networks, IPsec over RoCE, Selective repeat, Programmable congestion control interface, GPUDirect, Dynamically Connected Transport (DCT), Burst buffer offload |
| Miscellaneous |
| Compliant Standards | IEEE 802.3bs, 200 Gigabit Ethernet, IEEE 802.3cd, 50, 100 and 200 Gigabit Ethernet, IEEE 802.3bj, 802.3bm 100 Gigabit Ethernet, IEEE 802.3by, 25, 50 Gigabit Ethernet supporting all FEC modes, IEEE 802.3ba 40 Gigabit Ethernet, IEEE 802.3ae 10 Gigabit Ethernet, IEEE 802.3az Energy Efficient Ethernet (supports only “FastWake” mode), IEEE 802.3ap based autonegotiation and KR startup, IEEE 802.3ad, 802.1AX Link Aggregation, IEEE 802.1Q, 802.1P VLAN tagsand priority, IEEE 802.1Qaz (ETS), IEEE 802.1Qbb (PFC), IEEE 802.1Qbg, 25/50 Ethernet Consortium “Low Latency FEC” for50GE/100GE/200GE PAM4 links, PCI Express Gen 3.0 and 4.0 |
| Bracket Included | BKT-0205L - 0.5U height Narrow bracket for GrandTwin FIO systems |
| Power |
| Power Consumption | Maximum: 23.7W |
| Specification |
| Operating Conditions | Storage temperature: -40°C to 70°C (-40°F to 158°F) |
| Storage humidity: 90% non-condensing relative humidity at 35°C |
