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- Supermicro SBI-611E-1T2N SuperBlade 6U 1 Blade Node Single Intel Xeon Scalable Processors 4th Generation
Supermicro SBI-611E-1T2N SuperBlade 6U 1 Blade Node Single Intel Xeon Scalable Processors 4th Generation
• Enterprise data center
• Cloud, CDN, AI/ML
SuperBlade 6U 10 Node, Intel Xeon Scalable Processors 4th Generation, Intel C741 Chipset, Up to 4TB in 16 DIMM slots, RDIMM, Onboard: Intel Columbiaville Ethernet Controller E810-XXVAM2, 2 Hot-swap 2.5in U.2 NVMe/SATA3 Drive Bays, 3 M.2 2280/22110 NVMe Drives per Blade, 2 E1.S Drive Support, Network Connectivity : Dual 25G Ethernet, Additional Dual-port 25G Ethernet Via Mezzanine Card, (SBI-611E-1T2N + MBD-B13SEE-CPU-25G)
1. 70 servers per 42U Rack
2. Single socket E (LGA-4677) supports 4th Gen Intel® Xeon® Scalable processors
3. Intel® C741 chipset
4. 16 DDR5 DIMM slots, 2DPC with 4800MHz ECC RDIMM
5. 2 PCIe Gen5 slots; support up to 1 FHFL DW GPU or 2 SW PCIe cards
6. Support up to 7 drives per blade
7. Dual-port 25G Ethernet (LOM), additional dual-port 25G Ethernet via mezzanine card
8. Front IO with 2 PCIe 5.0 slots for GPU and network cards
9. Liquid cooling solution is available*
* Please contact your Supermicro sales rep for more info.
Extra Specifications for Supermicro SBI-611E-1T2N SuperBlade 6U 1 Blade Node Single Intel Xeon Scalable Processors 4th Generation
Product SKUs | ||
Product SKUs | ||
Processor | ||
CPU | 4th Gen Intel® Xeon® Scalable Processors | |
Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM) | ||
Single Socket E (LGA-4677) | ||
Note | Up to 250W TDP CPUs (Air Cooling at 35°C) | |
Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix . | ||
Up to 350W TDP CPUs (Direct Liquid Cooling) | ||
System Memory | ||
Memory Capacity | 2DPC with 4800MHz ECC RDIMM | |
16 DDR5 DIMM slots | ||
On-Board Devices | ||
Chipset | Intel® C741 chipset | |
Network Controllers | Onboard Dual 25G Ethernet | |
1 Mezzanine expansion slot | ||
Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR | ||
MGMT/Security | IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust | |
Graphics | Aspeed AST2600 | |
System BIOS | ||
BIOS Type | 256Mb SPI Flash EEPROM with AMI® BIOS | |
BIOS Features | USB Keyboard support | |
Plug and Play (PnP) | ||
PCI 2.2 | ||
ACPI up to 3.0 | ||
Dimensions | ||
Height | 9.75" | |
Width | 1.75" | |
Depth | 23.5" | |
Weight | 12.1 lbs (5.49 kg) | |
Available Colors | Black | |
Front Panel | ||
Buttons | Power On/Off button | |
LEDs | Power LED | |
Network Activity LED | ||
Fault LED | ||
UID | ||
Connector | SUV (Serial/USB/Video) Connector | |
Expansion Slots (per Node) | ||
PCIe | 1 PCIe Gen5 x16 slot, 1 PCIe Gen5 x8 slot, support 1 FHFL DW GPU or 2 SW PCIe cards | |
Drive Bays | ||
Hot-swap | 2 Hot-swap 2.5" U.2 NVMe/SATA3 drive bays | |
M.2 | 3 M.2 2280/22110 NVMe drives per blade | |
E1.S | 2 E1.S drive support | |
Input / Output | ||
TPM | 1 TPM 2.0 Header | |
Operating Environment | ||
RoHS | RoHS Compliant | |
Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) | |
Operating Relative Humidity: 8% to 90% (non-condensing) | ||
Non-operating Relative Humidity: 5% to 95% (non-condensing) | ||
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) |
Name | Part Number | Qty. | Description | |
---|---|---|---|---|
Motherboard / Chassis | MBD-B13SEE-CPU-25G | 1 | Super B13SEE-CPU-25G Motherboard | |
Motherboard / Chassis | MCP-680-61006-0N | 1 | 6U 10 SuperBlade UP B13 GPU Blade chassis, support 2x E1.S | |
Add-on Card / Module | AOM-BPN-SB10-P | 1 | 2xU.2 backplane for B12SPE-CPU,RoHS | |
Add-on Card / Module | AOM-BPNIO-E1S-P | 1 | I/O Module for SuperBlade, 2x E1.S connectors, PCIe x8 MCIO,RoHS | |
Add-on Card / Module | AOM-BPNIO-SNE3-P | 1 | SuperBlade I/O Module, x4 PCIe M.2 (2280/22110), SATA3, NVME GEN 4, E1.S connector ,RoHS | |
Riser Card | RSC-S-68G5 | 1 | 1U LHS Standard riser card with one PCI-E 5.0X16andonePC | |
Hard Drive Tray | MCP-220-00170-0B | 2 | Black hot swap tool-less NVMe 2.5" HDD tray with orange button | |
Air Shroud | MCP-310-61008-0B | 1 | 6U 10 SuperBlade B13SEE Processor Tray Air Shroud | |
Software | SFT-OOB-LIC • | 1 | OOB Management Package (per node license) |
Name | Part Number | Price | Add to Cart | Qty. | Description | |
---|---|---|---|---|---|---|
TPM security module(optional, not included) | AOM-TPM-9670V | $ 52.00 | 0 | TPM module (Vertical) TPM 2.0 | ||
TPM security module(optional, not included) | AOM-TPM-9671V | $ 52.00 | 0 | TPM module (Vertical) TPM 1.2. | ||
VROC | AOC-VROCPREMOD | $ 342.50 | 0 | Intel VROC Premium, RAID 0, 1, 5, 10 | ||
VROC | AOC-VROCSTNMOD | $ 133.50 | 0 | Intel VROC HW key (RSTe) standard upgrade module | ||
Heatsink / Retention | SNK-P1046V | $ 86.50 | 0 | Heatsink for Rear CPU | ||
CPU Carrier | SKT-1333L-0000-FXC | 0 | Socket E LGA4677, E1A, XCC, DG 0.7 | |||
CPU Carrier | SKT-1333L-0001-LTS | 0 | Socket E LGA4677, E1A, XCC, DG1.0, NO SHIM, BLK HSG | |||
CPU Carrier | SKT-1424L-001B-FXC | 0 | Socket E E1B LGA 4677 W/SHIM SP MCC, DG0.95 | |||
CPU Carrier | SKT-1424L-001B-LTS | 0 | Socket E E1B LAG 4677 W/SHIM SPR MCC, DG1.0 | |||
CPU Carrier | SKT-1425H-001C-FXC | 0 | Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7 | |||
CPU Carrier | SKT-1425H-001C-LTS | 0 | Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7 | |||
Networking | AOC-B25G-6X4D | 0 | Dual-port 25G Mezz card for SuperBlade 6U Chassis (Mellanox ConnectX-4 Lx EN) | |||
Networking | AOC-B25G-6CVL | 0 | 25G DUAL PORT MEZZANINE CARD,Intel Columbiaville, E810-XXVAM2 | |||
Software | SFT-DCMS-Single | 0 | DataCenter Management Package (per node license) |
Warranty: | 3 years labor, 1 year parts, 1 year advance replacement (doa) |
Coverage: | Replacement or repair |
Average Service Time: | Overnight replacement for 1 year, 2 weeks afterward |
E-mail: | returnservices@wiredzone.com |
If you need Technical Support for this item please contact: | |
Provider: | Supermicro |
Type of Support: | FULL |
Phone No.: | 408-503-8000 |
URL: | Click here for Manufacturer Website |