| Main Specifications |
| Device Type | SuperServer |
| Built-in Devices | Super X14DBT-B |
| Form Factor | 2U Rackmount - CSE-217BD2-R2K22P |
| Dimensions (WxDxH) | Height 3.47" (88 mm) x Width 17.68" (449 mm) x Depth 28.75" (730 mm) |
| Weight | Gross Weight: 80.7 lbs (36.6 kg) - Net Weight: 55.1 lbs (25 kg) |
| Enclosure Color | Black Front & Silver Body |
| Processor |
| Compatible Processors (per Node) | Intel Xeon 6 6700 series processors with E-cores |
| Compatible Socket (per Node) | Dual Socket E2 (LGA-4710) |
| Cache/Core (per Node) | Up to 144C/144T, Up to 108MB Cache per CPU |
| On-Board Devices |
| Chipset (per Node) | System on Chip |
| Network Connectivity (per Node) | Via AIOM |
| System Memory |
| Memory Capacity (per Node) | Slot Count: 16 DIMM slots, Max Memory (1DPC): Up to 4TB 64000MT/s ECC DDR5 RDIMM |
| Input / Output |
| LAN (per Node) | 1 RJ45 1 GbE Dedicated BMC LAN port(s) |
| USB (per Node) | 2 USB 3.0 Gen2 Type-A port(s) (Rear) |
| VGA (per Node) | 1 VGA port |
| System BIOS |
| BIOS Type | AMI 32MB Flash ROM |
| Management |
| Software | SuperCloud Composer, Supermicro Server Manager (SSM), Super Diagnostics Offline (SDO), Supermicro Thin-Agent Service (TAS), SuperServer Automation Assistant (SAA) New |
| Power Configurations | ACPI/APM Power Management |
| Security |
| Hardware | Trusted Platform Module (TPM) 2.0, Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware, Secure Boot, Secure Firmware Updates, Automatic Firmware Recovery, Supply Chain Security: Remote Attestation, Runtime BMC Protections, System Lockdown |
| PC Health Monitoring |
| FAN | Fans with tachometer monitoring, Status monitor for speed control, Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment |
| Processor (per Node) |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory. 8+4 Phase-switching voltage regulator |
| Front Panel |
| LEDs | HDD activity LED, Network activity LEDs, Power status LED, Universal Information (UID) LED |
| Buttons | Power On/Off button, UID button |
| Expansion Slots |
| Expansion Slots (per node) | 2 PCIe 5.0 x8 LP slot(s), 1 PCIe 5.0 x16 LP slot(s), 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) |
| Expansion / Connectivity |
| Expansion Bays (per node) | 12 front hot-swap 2.5" PCIe 5.0 NVMe drive bay(s) |
| Drive Bays |
| M.2 (per node) | 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default); VROC required for RAID) |
| System Cooling |
| Fans/Air Shroud | 4x 16.5K RPM Heavy Duty 80x80x38mm Fan(s) |
| Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply |
| Power Supply | 2x 2200W Redundant (1 + 1) Titanium Level (96%) power supplies |
| Environmental |
| Operating Environment | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) |
| Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) |
| Operating Relative Humidity: 8% to 80% (non-condensing) |
| Non-operating Relative Humidity: 8% to 90% (non-condensing) |
| Miscellaneous |
| Environmental Compliance | RoHS Compliant |
