| Product SKUs |
| Product SKUs | SYS-322GA-NR |
| Motherboard |
| Motherboard | Super X14DBG-XAP |
| Processor |
| CPU | Dual Socket BR (LGA-7529) |
| Intel® Xeon® 6900 series processors with P-cores |
| Core Count | 128C/256T; 504MB Cache per CPU |
| Note | Supports up to 500W TDP CPUs (Air Cooled) |
| GPU |
| Max GPU Count | Up to 8 double-width or 19 single-width GPUs |
| Supported GPU | View GPU Options |
| NVIDIA PCIe: H100 NVL, NVIDIA RTX PRO™ 6000 Blackwell Server Edition, H200 NVL (141GB), L40S |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | NVIDIA® NVLink® Bridge (optional) |
| System Memory |
| Memory | View Memory Options |
| Slot Count: 24 DIMM slots/1 Channels |
| Max Memory (1DPC): 6TB 6400MT/s ECC DDR5 RDIMM |
| Max Memory (1DPC): 6TB 8800MT/s ECC DDR5 MRDIMM |
| Memory Voltage | 1.1V |
| On-Board Devices |
| Chipset | System on Chip |
| Network Connectivity | View AOC Options |
| Input / Output |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 2 USB 3.2 Gen1 Type-A ports |
| Video | 1 VGA port |
| TPM | 1 TPM header |
| System BIOS |
| BIOS Type | AMI 64MB SPI Flash EEPROM |
| Management |
| Software | Supermicro Thin-Agent Service (TAS) |
| Supermicro Server Manager (SSM) |
| SuperCloud Composer® |
| Super Diagnostics Offline (SDO) |
| SuperServer Automation Assistant (SAA) New! |
| Power configurations | Power-on mode for AC power recovery |
| ACPI Power Management |
| Security |
| Hardware | Trusted Platform Module (TPM) 2.0 |
| Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware |
| Secure Boot |
| Secure Firmware Updates |
| Automatic Firmware Recovery |
| Supply Chain Security: Remote Attestation |
| Runtime BMC Protections |
| System Lockdown |
| PC Health Monitoring |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Status monitor for speed control |
| Pulse Width Modulated (PWM) fan connectors |
| Fans with tachometer monitoring |
| Temperature | Monitoring for CPU and chassis environment |
| Thermal Control for fan connectors |
| Chassis |
| Form Factor | 3U Rackmount |
| Model | CSE-MX301TS-R0NDFP |
| Dimensions and Weight |
| Height | 5.2" (132.1 mm) |
| Width | 17.26" (438.4 mm) |
| Depth | 31.5" (800 mm) |
| Package | 13" (H) x 29" (W) x 47" (D) |
| Weight | Gross Weight: 70.4 lbs (32 kg) |
| Net Weight: 135 lbs (61.24 kg) |
| Available Color | Silver |
| Front Panel |
| LED | Universal Information (UID) LED |
| Expansion Slots |
| PCI-Express (PCIe) Configuration |
| CXL Support |
| M.2 |
| Drive Bays / Storage |
| Drive Bays Configuration | (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details) |
| 2 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| 4 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| Option A: Total 6 bays 6 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays |
| 6 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays |
| Option B: Total 14 bays 14 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays |
| 14 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays |
| Option C: Total 2 bays 2 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| Option D: Total 4 bays 4 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| Option E: Total 6 bays 6 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| 6 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays |
| M.2 | View M.2 Options |
| 2 M.2 PCIe 5.0 x2 NVMe slots (M-key) |
| System Cooling |
| Fans | 5 Front 8cm Fan(s) |
| 6 Internal 6cm Fan(s) |
| Air Shroud | 1 Air Shroud |
| Operating Environment |
| Environmental Spec. | Operating Relative Humidity: 8% to 90% (non-condensing) |
| Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) |
| Operating Temperature: 10°C to 35°C (50°F to 95°F) |
