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Toshiba Hard Drive SSD 512GB NVMe PCIe 3.1 x4, BiC S3TLC M.2 2280 <1DWPD - XG5 Series

SKU: 10027950
MFG Part Number: KXG50ZNV512G
Out of Stock
 
• Idela for Enthusiast Desktop/Laptop
• Compact single-sided M.2 2280 form factors
• 512GB - 3D TLC (3-bit-per-cell) flash memory
• Host Controlled Thermal Management is supported
$90.48
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Hard Drive SSD 512GB M.2 NVMe PCIe 3.1 x4, BiC S3TLC 2280 <1DWPD - XG5 Series
• Device Self-test is supported
• Host Controlled Thermal Management (HCTM) is supported
• Strong & highly-efficient ECC named QSBCTM is supported
• Storage Interface Interactions Specification(SIIS) Version 1.06 is supported
Products specifications
Main Specifications
Capacity 512GB
Dimensions (WxDxH) Height 2.23 x Width 22.0 x Length 80.0 mm
Form Factor M.2 22 x 80mm
Interface 32 GT/s (PCIe / Gen3x4 Lane)
PCI Express Base Specification Revision 3.1a (NVM Express Revision 1.2.1 command set)
NAND Flash Memory Type TLC (BiCS Flash)
Weight 10 grams
Performance
Read 2,700 MB/s {2,580 MiB/s}
Write 1,050 MB/s {1,000 MiB/s}
Reliability
MTBF 1,500,000 hours
Environmental Parameters
Non-Operating Operating Temperature -40 to 85 °C
Shock Tolerance Operating/Non-operating: 14.7 km/s2 { 1,500 G } ( 0.5 ms )
Vibration Tolerance Operating/Non-operating: 196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Min Operating Temperature 0 to 95 °C ( Contorller Temperature )
0 to 85 °C ( Other Components Temperature )
Power
Power Consumption 4.0 W typ.
Miscellaneous
Applications Thin performance Notebook
Enthusiast Desktop/Laptop
Mainstream PC Computing
Server / Storage Boot
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Warranty:5 years
Provider:Manufacturer
Phone No.:305-640-0300
E-mail:returnservices@wiredzone.com
URL:Click here for Manufacturer Website
Coverage:Replacement or Repair
Average Service Time:1-2 weeks
If you need Technical Support for this item please contact:

Provider:Toshiba Corporation
Type of Support:FULL
Phone No: 800-457-7777
URL:Click here for Manufacturer Website
Product description
Hard Drive SSD 512GB M.2 NVMe PCIe 3.1 x4, BiC S3TLC 2280 <1DWPD - XG5 Series
Products specifications
Main Specifications
Capacity 512GB
Dimensions (WxDxH) Height 2.23 x Width 22.0 x Length 80.0 mm
Form Factor M.2 22 x 80mm
Interface 32 GT/s (PCIe / Gen3x4 Lane)
PCI Express Base Specification Revision 3.1a (NVM Express Revision 1.2.1 command set)
NAND Flash Memory Type TLC (BiCS Flash)
Weight 10 grams
Performance
Read 2,700 MB/s {2,580 MiB/s}
Write 1,050 MB/s {1,000 MiB/s}
Reliability
MTBF 1,500,000 hours
Environmental Parameters
Non-Operating Operating Temperature -40 to 85 °C
Shock Tolerance Operating/Non-operating: 14.7 km/s2 { 1,500 G } ( 0.5 ms )
Vibration Tolerance Operating/Non-operating: 196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Min Operating Temperature 0 to 95 °C ( Contorller Temperature )
0 to 85 °C ( Other Components Temperature )
Power
Power Consumption 4.0 W typ.
Miscellaneous
Applications Thin performance Notebook
Enthusiast Desktop/Laptop
Mainstream PC Computing
Server / Storage Boot
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